YESTech YesTech YTV F1 PCB Inspection System Thin Camera Technology

Product Information

Hey there! Looking for a high-speed PCB inspection system with exceptional defect coverage? Meet the YESTech YTV F1, equipped with advanced Thin Camera technology, offering up to two top-down viewing cameras and four side viewing cameras. This system is designed to inspect solder joints and verify correct part assembly, ultimately improving quality and increasing throughput. What's exciting is that programming the F1-Series is fast and intuitive, taking operators less than 30 minutes to create a complete inspection program including solder inspection. Its standard package library simplifies training and ensures program portability across manufacturing lines. The YTV F1 has a maximum board size of 22 x 20 (560mm x 510mm) and offers a throughput of up to 5 sq. in./sec., making it a powerhouse in the laboratory environment with applications in PCB manufacturing, electronics assembly, and quality control. This equipment comes with a 30-Day Warranty, 100% Parts and Labor, and runs on 120V and 60Hz US. It's a fantastic addition to any lab seeking efficient, high-quality PCB inspection and verification.

• Thin Camera Technology for High-Speed PCB Inspection
• Advanced Inspection Capabilities Including Solder Joint Verification
• Fast and Intuitive Programming for Efficient Operation
• Standard Package Library for Simplified Training and Program Portability
• 30-Day Warranty, 100% Parts and Labor Coverage
• Operates on 120V, 60Hz US Voltage

• Throughput: Up to 5 sq. in./sec. > 250,000 components per hour
• Maximum Board Size: 22 x 20 (560mm x 510mm)
• Clearance: 2" (50mm) top and bottom
• Minimum Component Size: 0201; 01005 with high magnification option
• Defects Detected: Component - position, missing, wrong, polarity, skew, tombstone; Lead - bent, lifted, bridging; Solder - open, insufficient, short, solder balls
• Algorithms: Normalized correlation, OCV, OCR, barcode recognition, rule-based
• CAD Input: Pick and place data, CAD x-y data
• Programming Skill Level: Technician or operator
• Operating System: Windows XP Professional
• Outputs: Real-time SPC outputs reporting first pass yield, defect by classification, reference designator and part number with remote monitoring

Metric: 975 kg
Imperial: 2150 lbs

Metric: 57 cm x 55 cm x 50 cm
Imperial: 22.44 in x 21.65 in x 19.69 in

903180

903180 - Optical instruments and apparatus; for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices