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Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C
Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C

Cee Apogee Bake Plate Semiconductor Wafer Hot Plate 300C

sku: 3320526381
1 In Stock

Cee Cost Effective Equipment

Apogee Bake Plate
US West Coast US - R
30-Day Warranty On Part
$11,995.00
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Details

  • Category
    Other
  • Dimension
    14.0in x 23.0in x 18.0in
  • Serial
    2212232
  • Shipping Type
    FedEx Ground
  • Voltage / Hertz
    110-125V / 50Hz/60Hz

Description

Product Information

The Cee Apogee Bake Plate, manufactured by Cee Cost Effective Equipment, is a pre-owned semiconductor wafer processing hot plate designed for precision thermal baking in photolithography and microfabrication processes. This unit, identified by serial number 2212232, features a 7-inch color touchscreen interface and supports various baking methods including contact, vacuum, and proximity bake. It accommodates substrates up to 200 mm round or 8" x 8" square, with a temperature range from ambient to 300°C, and an optional configuration up to 400°C. The unit has been inspected and is in working order, with the heating function tested successfully. It shows normal cosmetic wear from previous use, and buyers are advised to validate its suitability for specific applications.


Technician comment

Unit powers on and touchscreen functions properly. Heating function was tested and the bake plate reached the selected temperature. Full calibration and process verification were not performed. Has slight cosmetic blemishes from normal use. See photos for details


Key Features
  • Precision thermal baking
  • Programmable bake recipes
  • Temperature uniformity
  • 7-inch color touchscreen
  • Supports contact, vacuum, and proximity bake

Specifications
  • Maximum substrate size: 200 mm round wafer or 8" x 8" square
  • Temperature range: Ambient to 300°C
  • Voltage: 110-125V
  • Hertz: 50Hz/60Hz

Weight

Imperial: 90.0 Pounds
Metric: 40.82 Kilograms


Shipping Dimensions

Imperial: 16.8 in x 27.6 in x 21.6 in
Metric: 42.67 cm x 70.1 cm x 54.86 cm


Harmonized Code

8514.10


Harmonized Code Details

Industrial or laboratory electric furnaces and ovens, including those functioning by induction or dielectric loss. Suitable for semiconductor processing equipment.