Disco DFD6341 Dicing Saw Fully Automatic Dual Spindle
Disco co.
Details
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CategoryMiscellaneous
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Dimension46.0in x 48.0in x 75.0in
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SerialJWB228
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Shipping TypeFreight
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Manufacturing2022-05-01
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Voltage / Hertz200-240V / 50Hz/60Hz
Description
The Disco DFD6341 Fully Automatic Dicing Saw, manufactured in May 2022, is a pre-owned unit in working order, designed for enhanced productivity with its dual spindle system. This model supports Φ8-inch wafers and incorporates technology from the DFD6362, allowing for increased throughput. It features a unique axis mechanism enabling X-axis return speeds up to 1,000 mm/s, improving acceleration and deceleration for maximum speed movement. The space-saving design reduces the footprint by 3% compared to previous models, and it includes a user-friendly GUI with an LCD touch panel for easy operation. The DFD6341 is ideal for applications requiring precise dicing of semiconductor wafers, offering optional high-speed flash alignment for reduced alignment time.
Technician comment
Preowned from a working environment, decommissioned April 2026
Key Features
- Dual spindle system
- X-axis return speed up to 1,000 mm/s
- Space-saving design
- User-friendly GUI with LCD touch panel
- Optional high-speed flash alignment
Specifications
- Voltage: 200-240V
- Hertz: 50Hz/60Hz
- Max. workpiece size: Φ8 inch
- X-axis cutting range: 210 mm
- X-axis cutting speed: 0.1 ～ 1,000 mm/s
- Y1･Y2-axis cutting range: 210 mm
- Index step: 0.0001 mm
- Positioning accuracy: Within 0.002/210 mm
- Z-axis max. stroke: 19.22 mm (Φ2 inch blade)
- Z-axis moving resolution: 0.00005 mm
- Repeatability accuracy: 0.001 mm
- θ-axis max. rotating angle: 380 degrees
- Spindle rated torque: 0.19 N・m (1.2 kW/High speed rotation)
- Rotation speed range: 6,000 ～ 60,000 min‐1 (1.2 kW/1.8 kW)
- Equipment dimensions (W×D×H): 1,180 × 1,080 × 1,820 mm
- Equipment weight: Approx. 1,500 kg
Weight
Imperial: 3960.0 Pounds
Metric: 1796.22 Kilograms
Shipping Dimensions
Imperial: 55.2 in x 57.6 in x 90.0 in
Metric: 140.21 cm x 146.3 cm x 228.6 cm
Harmonized Code
8464.10
Harmonized Code Details
Machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass. Suitable for semiconductor wafer dicing applications.
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