NxQ Neutronix Quintel 8008 Mask Aligner Lithography DVIA-MB1000
NxQ Neutronix Quintel
Details
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CategoryMiscellaneous
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Dimension57.0in x 46.0in x 80.0in
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Serial98-98456-01
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Shipping TypeFreight
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Manufacturing2020-11-01
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Voltage / Hertz100-240V / 50Hz/60Hz
Description
The NxQ Neutronix Quintel 8008 Manual Load Mask Aligner, manufactured in November 2020, is a pre-owned unit in working condition, originating from a functional laboratory environment. This aligner is designed for precision alignment in demanding applications, featuring sub-micron accuracy of less than ±0.5µm for critical layers. It supports wafers ranging from 100mm to 200mm and utilizes AI-enhanced pattern recognition for reliable alignment. The device is equipped with UV-LED exposure optics, offering superior printing performance compared to mercury bulb sources, with a lifespan of 7-10 years in high-volume manufacturing environments. The manual load system allows for efficient wafer handling without robotic automation, making it suitable for facilities that prioritize workflow flexibility. Ideal for microelectronics, MEMS, and advanced packaging processes, the NxQ 8008 ML is a versatile tool for R&D centers and manufacturing facilities worldwide. Buyers should validate its suitability for specific applications.
Technician comment
Preowned unit from a working laboratory environment. Unit was removed from an operational facility. Additional testing was limited due to available setup and facility requirements. Overall condition is consistent with normal laboratory use. Please review photos for additional details.
Key Features
- Sub-micron alignment precision <±0.5µm
- Handles wafers from 100mm to 200mm
- AI-enhanced pattern recognition
- UV-LED exposure optics
- Manual load system for flexibility
Specifications
- Voltage: 100-240V
- Hertz: 50Hz/60Hz
- Exposure Modes: Soft, Pressure, Vacuum Contact, Proximity
- Print Resolution: Proximity – 3um at 20um gap, Soft Contact – 2um, Hard Contact – 1um, Vacuum Contact – 0.6um
- Substrate Size: Up to 8”, Up to 10mm thick
- Mask Size: 3” X 3” up to 9” X 9”
- Alignment Travel X-Y: +/- 4mm, 100nm resolution
- Theta Rotation Range: +/- 7.5 degrees, 4x10e-5 resolution
- Mask/Wafer separation: 0 – 1000um with 1um resolution
Weight
Imperial: 3600.0 Pounds
Metric: 1632.93 Kilograms
Shipping Dimensions
Imperial: 68.4 in x 55.2 in x 96.0 in
Metric: 173.74 cm x 140.21 cm x 243.84 cm
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